Inside the HTC One (M8): very difficult to repair

Very quickly after launch, the HTC One (M8) has appeared on the "operating table" of the "doctor" comes from iFixit site and they will tell us within this new device have what detailed . At first engineers found few screws and they think that the M8 will be easy to fix, but then things become more complicated because they have to remove a lot of the tape insulation to reach the components inside. When on the motherboard, the iFixit discovered more that these components are glued to the body, then the battery is like. During the implementation process, and he also accidentally cut cable digitization by computer screen should no longer be used (by touch operation can not be recognized).

Indeed, the before the early One such repair is difficult, and only scored 2/10 in terms of the level of repairs, but HTC says that it has some special tools to do this and the technician have to not take much time to replace components. It is unclear What is the M8. In wait time, the answer from HTC invite you to check out the operation of iFixit okay.

This is HTC One before dissection.

Version for Verizon network

Open the SIM tray. One poke with similar SIM.

Remove the front lid.....

.... to reveal the inside of a few small screws. Seemingly simple story.

Want to open the lid off , it have to pry the screen. Also quite difficult.

This is the monolithic aluminum back casing and the screen-board-main event of device link.

Slowly remove the cables.

Must add a bunch of tape stripping insulation again, then see the below components also as removing the motherboard.

Peel off any screen. Must be removed at the new glue to do it right.

Motherboards with the key components of the M8. The red  is the Qualcomm Snapdragon 801 processor clocked at quad-core 2.3 GHz with 2GB RAM produced by Elpida, The green is two-chip of power management, the blue is power amplifiers, The purple is the touch controller and The black is the signal acquisition by Qualcomm .

Next to pry and remove the glue to the screen in the battery area.

This is a 2600mAh capacity battery ,  higher 300mAh than last year's model.

Remove the sub motherboard at the top of the One M8.

And here is the camera behind. We have two cameras are connected together into a block. The small camera that you see in here is responsible for capturing information of depth image to  capture  before and focus after.

And here is the sub camera 5 megapixel on the front M8.

Red chip are NFC controller.

Remove the BoomSound speaker from the M8 (also one half on top of the camera). BoomSound is one of the features people highly appreciated by life One of the first and it looks like it will not change on M8.

measure the thickness of the screen: 2.1 mm.

All the components of the One M8 after dissection.

Only 2 /10. That is very difficult to repair.